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international rectifier?s r5 tm technology provides high performance power mosfets for space applications. these devices have been characterized for single event effects (see) with useful performance up to an let of 80 (mev/(mg/cm 2 )). the combination of low r ds(on) and low gate charge reduces the power losses in switching applications such as dc to dc converters and motor control. these devices retain all of the well established advantages of mosfets such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters. www.irf.com 1 features: single event effect (see) hardened ultra low r ds(on) low total gate charge simple drive requirements ease of paralleling hermetically sealed surface mount ceramic package light weight for footnotes refer to the last page smd-2 product summary radiation hardened power mosfet surface mount (smd-2) technology IRHNA597160 jansr2n7550u2 100v, p-channel ref: mil-prf-19500/713 part number radiation level r ds(on) i d qpl part number IRHNA597160 100k rads (si) 0.049 ? -47a jansr2n7550u2 irhna593160 300k rads (si) 0.049 ? -47a jansf2n7550u2 absolute maximum ratings parameter units i d @ v gs = -12v, t c = 25c continuous drain current -47 i d @ v gs = -12v, t c =100c continuous drain current -30 i dm pulsed drain current -188 p d @ t c = 25c max. power dissipation 250 w linear derating factor 2.0 w/c v gs gate-to-source voltage 20 v e as single pulse avalanche energy 400 mj i ar avalanche current -47 a e ar repetitive avalanche energy 25 mj dv/dt peak diode recovery dv/dt -10 v/ns t j operating junction -55 to 150 t stg storage temperature range pckg. mounting surface temp. 300 (for 5s) weight 3.3 (typical) g pre-irradiation c a pd-94493c
IRHNA597160, jansr2n7550u2 pre-irradiation 2 www.irf.com thermal resistance parameter min typ max units t est conditions r thjc junction-to-case ? ? 0.50 r thj-pcb junction-to-pc board ? 1.6 ?

c/w note: corresponding spice and saber models are available on the international rectifier website. for footnotes refer to the last page source-drain diode ratings and characteristics parameter min typ max units t est conditions i s continuous source current (body diode) ? ? -47 i sm pulse source current (body diode) ? ? -188 v sd diode forward voltage ? ? -5.0 v t j = 25c, i s = -47a, v gs = 0v t rr reverse recovery time ? ? 230 ns t j = 25c, i f = -47a, di/dt -100a/ s q rr reverse recovery charge ? ? 1.6 cv dd -50v t on forward turn-on time intrinsic turn-on time is negligible. turn-on speed is substantially controlled by l s + l d . a electrical characteristics @ tj = 25c (unless otherwise specified) parameter min typ max units test conditions bv dss drain-to-source breakdown voltage -100 ? ? v v gs = 0v, i d = -1.0ma ? bv dss / ? t j temperature coefficient of breakdown ? -0.1 ? v/c reference to 25c, i d = -1.0ma voltage r ds(on) static drain-to-source on-state ? ? 0.049 ? v gs = -12v, i d = -30a resistance v gs(th) gate threshold voltage -2.0 ? -4.0 v v ds = v gs , i d = -1.0ma g fs forward transconductance 24 ? ? s v ds > -15v, i ds = -30a i dss zero gate voltage drain current ? ? -10 v ds = -80v ,v gs =0v ? ? -25 v ds = -80v, v gs = 0v, t j =125c i gss gate-to-source leakage forward ? ? -100 v gs = -20v i gss gate-to-source leakage reverse ? ? 100 v gs = 20v q g total gate charge ? ? 170 v gs =-12v, i d = -47a q gs gate-to-source charge ? ? 65 nc v ds = -50v q gd gate-to-drain (?miller?) charge ? ? 30 t d (on) turn-on delay time ? ? 30 v dd = -50v, i d = -47a, t r rise time ? ? 100 v gs =-12v, r g = 2.35 ?, t d (off) turn-off delay time ? ? 100 t f fall time ? ? 100 l s + l d total inductance ? 4.0 ? c iss input capacitance ? 6240 ? v gs = 0v, v ds = -25v c oss output capacitance ? 1570 ? p f f = 1.0mhz c rss reverse transfer capacitance ? 115 ? na nh ns a measured from the center of drain pad to the center of source pad
www.irf.com 3 pre-irradiation IRHNA597160, jansr2n7550u2 international rectifier radiation hardened mosfets are tested to verify their radiation hardness capability. the hardness assurance program at international rectifier is comprised of two radiation environments. every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the to-3 package. both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. radiation characteristics fig a. single event effect, safe operating area international rectifier radiation hardened mosfets have been characterized in heavy ion environment for single event effects (see). single event effects characterization is illustrated in fig. a and table 2. for footnotes refer to the last page table 2. single event effect safe operating area ion let energy range v ds (v) (mev/(mg/cm 2 )) (mev) (m) @v gs =0v @v gs =5v @v gs =10v @v gs =15v @v gs =17.5v br 37.9 252.6 33.1 -100 -100 -100 -100 -100 i 59.7 314 30.5 -100 -100 -100 -100 -75 au 82.3 350 28.4 -100 -100 -100 -30 ? -100 -25 ? @v gs =20v -120 -100 -80 -60 -40 -20 0 0 5 10 15 20 vgs vds br i au table 1. electrical characteristics @ tj = 25c, post total dose irradiation parameter 100k rads(si) 1 300krads(si) 2 units test conditions min max min max bv dss drain-to-source breakdown voltage -100 ? -100 ? v v gs = 0v, i d = -1.0ma v gs(th) gate threshold voltage -2.0 -4.0 -2.0 -5.0 v gs = v ds , i d = -1.0ma i gss gate-to-source leakage forward ? -100 ? -100 na v gs =-20v i gss gate-to-source leakage reverse ? 100 ? 100 v gs = 20 v i dss zero gate voltage drain current ? -10 ? -10 a v ds = -80v, v gs =0v r ds(on) static drain-to-source ? 0.05 ? 0.05 ? v gs = -12v, i d =-30a on-state resistance (to-3) v sd diode forward voltage ? -5.0 ? -5.0 v v gs = 0v, i s = -47a 1. part number IRHNA597160 (jansr2n7550u2) 2. part number irhna593160 (jansf2n7550u2)
IRHNA597160, jansr2n7550u2 pre-irradiation 4 www.irf.com normalized on-resistance vs. temperature typical output characteristics typical output characteristics typical transfer characteristics 15 10 100 1000 4.0 5.0 6.0 7.0 8.0 9.0 10.0 v = -25v 20s pulse width ds -v , gate-to-source voltage (v) -i , drain-to-source current (a) gs d t = 25 c j t = 150 c j -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d -12v -52a 0.1 1 10 100 -v ds , drain-to-source voltage (v) 1 10 100 1000 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) -4.0v 20s pulse width tj = 25c vgs top -15v -12v -10v -6.0v -5.5v -5.0v -4.5v bottom -4.0v 0.1 1 10 100 -v ds , drain-to-source voltage (v) 1 10 100 1000 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) -4.0v 20s pulse width tj = 150c vgs top -15v -12v -10v -6.0v -5.5v -5.0v -4.5v bottom -4.0v -47a
www.irf.com 5 pre-irradiation IRHNA597160, jansr2n7550u2
maximum safe operating area typical gate charge vs. gate-to-source voltage typical capacitance vs. drain-to-source voltage typical source-drain diode forward voltage 0.1 1 10 100 1000 0.0 1.5 3.0 4.5 6.0 -v ,source-to-drain voltage (v) -i , reverse drain current (a) sd sd v = 0 v gs t = 25 c j t = 150 c j 1 10 100 0 2000 4000 6000 8000 10000 -v , drain-to-source voltage (v) c, capacitance (pf) ds v c c c = = = = 0v, c c c f = 1mhz + c + c c shorted gs iss gs gd , ds rss gd oss ds gd c iss c oss c rss 0 40 80 120 160 200 240 0 4 8 12 16 20 q , total gate charge (nc) -v , gate-to-source voltage (v) g gs for test circuit see figure i = d 13 -52a v = -20v ds v = -50v ds v = -80v ds -47a 1 10 100 1000 -v ds , drain-tosource voltage (v) 1 10 100 1000 - i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 150c single pulse 1ms 10ms operation in this area limited by r ds (on) 100 s
IRHNA597160, jansr2n7550u2 pre-irradiation 6 www.irf.com fig 10b. switching time waveforms fig 11. maximum effective transient thermal impedance, junction-to-case maximum drain current vs. case temperature fig 10a. switching time test circuit
1 0.1 % + - v ds 90% 10% v gs t d(on) t r t d(off) t f 25 50 75 100 125 150 t c , case temperature (c) 0 10 20 30 40 50 - i d , d r a i n c u r r e n t ( a ) 0.001 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response)
www.irf.com 7 pre-irradiation IRHNA597160, jansr2n7550u2 fig 13b. gate charge test circuit fig 13a. basic gate charge waveform fig 12c. maximum avalanche energy vs. drain current fig 12b. unclamped inductive waveforms fig 12a. unclamped inductive test circuit q g q gs q gd v g charge d.u.t. v ds i d i g -3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - r g i as 0.01 ? t p d.u.t l v ds v dd driver a 15v -20v t p v ( br ) dss i as 25 50 75 100 125 150 0 200 400 600 800 e , single pulse avalanche energy (mj) as i d top bottom -21a -29.7a -47a starting t j , junction temperature (c)
IRHNA597160, jansr2n7550u2 pre-irradiation 8 www.irf.com pulse width 300 s; duty cycle 2% total dose irradiation with v gs bias. -12 volt v gs applied and v ds = 0 during irradiation per mil-std-750, method 1019, condition a. total dose irradiation with v ds bias. -80 volt v ds applied and v gs = 0 during irradiation per mll-std-750, method 1019, condition a. repetitive rating; pulse width limited by maximum junction temperature. v dd = -50v, starting t j = 25c, l=0.36mh peak i l = -47a, v gs = -12v i sd -47a, di/dt - 450a/ s, v dd -100v, t j 150c footnotes: case outline and dimensions ? smd-2 ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 ir leominster : 205 crawford st., leominster, massachusetts 01453, usa tel: (978) 534-5776 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . data and specifications subject to change without notice. 12/2007

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